Elmo Motion Control uses IPC–A–610C standards as a means of establishing quality solder joints. It
is recommended that manufacturing processes using the following pin-based drives and amplifiers refer to these
same standards:
All solder joints should have a smooth, shiny appearance and exhibit wetting as exemplified by
a concave meniscus between the objects being soldered. The solder fillet should appear smooth and exhibit good
wetting of the solder to the parts being joined. Also, a feathered edge shall be created by solder at the part
being joined, and the fillet should be concave in shape.
Soldering
Procedure for Pin-based Products
Soldering Elmo pin-based
drives and amplifiers to a printed circuit board
(PCB) is a straightforward process that does not involve
any special considerations beyond standardized soldering
practices. Reliable solder joints depend on the repeatability
of a proven procedure in the manufacturing process. In
an effort to facilitate this, the following should serve
as the basis for the procedure.
Technical
Description
Elmo Motion Control has
evaluated one tip size for the Weller soldering iron (Model
WECP – 20) or equivalent soldering iron to determine
the best method for soldering the pin-based
drives and amplifiers. The following matrix calls
out the parameters recommended by our manufacturing engineers
and can be used in a production environment.
Hand
Soldering to PC Board
Pin-based
Drives and Amplifiers
500º F ( 260ºC
)
Control Pins ( 0.5mm )
5 to 10 Sec.
Power Pins ( 1.14mm )
6 to 12 Sec.
Tested with 1.6mm
thick PC board
Weller Model WECP
– 20 ( 25W ) soldering iron or equivalent
Times specified
in table are the soldering times required to achieve a
topside fillet per IPC – A – 610C
Wave
soldering
The pin-based
drives and amplifiers achieve an adequate topside
fillet formation on a wave soldering machine with conveyor
speeds from three to seven feet minute.
Pin-based
Drives and Amplifiers
500º F ( 260ºC
)
Control Pins ( 0.5mm )
5 to 10 Sec.
Power Pins ( 1.14mm )
6 to 12 Sec.
Cleaning
Cleaning the assemblies
should be preformed as necessary to remove foreign matter
and flux residues. Assemblies must be cleaned in a manner
such that the intrusion of cleaning material into the
drive does not occur. Elmo products are not hermetically
sealed; all the assembled boards are coated with “
HumiSeal “ conformal coating type 1B31.
Care should be taken to avoid forcing liquid into the drives.
Mounting the drive with the “belly” recessed into
a cutout is at most risk from a high-pressure aqueous wash.
This cleaning method must be avoided.
Intrusion of cleaning solvent into the drive can damage it by
dissolving the HumiSeal coating and creating corrosive conditions
inside the drive.
As with any electronic component, corrosive and/or mobile ions
that may be present in RA or OA flux residues should not be
allowed to remain on or under the drive after soldering. The
cleaning process should done by hand using a brush.
